Application-oriented designs, consisting of a meander of opposing thermocouples that are embedded in a substrate.
FQ90xxx
Heat Flow PLates Type
Technical
Features:
¡Ü For
determining the heat flow density up to max. 150¡ÆC. ¡Ü
Application-oriented designs, consisting of a meander of opposing thermocouples
that are embedded in a substrate. ¡Ü
In case of thick substrates no lateral circulation of the heat flow because
of sufficient meander shell zone. ¡Ü
Software for k value measurement, see page 06.07.
¢Æ Each heat
flow plate has been assigned a calibration
value, which corresponds to the heat flow density in
W/m2 when the plate provides an output of 1mV. The
calibration value will be stored as factory-setting in the
ALMEMO¢ç connector so that ALMEMO¢ç devices will
immediately indicate the current heat flow density in
W/m2.
Types:
Model
Application
117
FQA017C
for even surfaces,
e.g. casement sections
118
FQA018C
for universal applications,
e.g. solar-electric systems and insulating plates
119
FQA019C
especially for constructional industry, brickwork
insulating plates, old buildings
120
FQA020C
small heat flow plate,
e.g. for medicine, veterinary medicine, small components etc.
117 SI
FQA017CSI
flexible heat flow plate, suitable for even surfaces,
e.g. casement sections
118 SI
FQA018CSI
flexible heat flow plate, suitable for even surfaces,
e.g. solar-electric systems and insulating plates
150-1
FQA0801H
flexible heat flow plate, particularly suitable for
high temperatures
e.g. for brickwork, insulated boilers and pipes
150-2
FQA0802H
particularly suitable for high temperatures, especially
for the construction industry,
masoned walls and insulating plates
Technical Data:
Type
Dimensions
(mm)
Meander Size
(mm)
Substrate
Temperature
Stability
Calibr. Val. approx.
(W/m2 ~ 1 mV)
Accuracy
of Calibr. Value
117
100 x 30 x 1.5
80 x 20
epoxy resin
80¡ÆC
< 50
5% at 25¡ÆC
118
120 x 120 x 1.5
90 x 90
epoxy resin
80¡ÆC
< 15
5% at 25¡ÆC
119
250 x 250 x 1.5
180 x 180
epoxy resin
80¡ÆC
< 8
5% at 25¡ÆC
120
33 ¨ª x 1.5 20
20 ¨ª
epoxy resin
80¡ÆC
< 150
5% at 25¡ÆC
117SI
100 x 30 x 3
80 x 20
silicone
80¡ÆC
< 50
5% at 25¡ÆC
118SI
120 x 120 x 3
90 x 90
silicone
80¡ÆC
< 15
5% at 25¡ÆC
150-1
180 x 100 x 0.6
170 x 90
Teflon
150¡ÆC
< 80
5% at 25¡ÆC
150-2
500 x 500 x 0.6
490 x 490
Teflon
150¡ÆC
< 10
5% at 25¡ÆC
Accessories:
ZB9000WP
Heat-conducting paste
ZQ9017KB
Scotch tape for room temperature
ZQ9017KF
Self-adhesive film 24 x 100cm for room temperature