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FQ90xxx Heat Flow PLates Type
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Application-oriented designs, consisting of a meander of opposing thermocouples that are embedded in a substrate.
FQ90xxx  Heat Flow PLates Type
Technical Features:
¡Ü
For determining the heat flow density up to max. 150¡ÆC.
¡Ü Application-oriented designs, consisting of a meander of opposing thermocouples that are embedded in a substrate.
¡Ü In case of thick substrates no lateral circulation of the heat flow because of sufficient meander shell zone.
¡Ü Software for k value measurement, see page 06.07.

¢Æ Each heat flow plate has been assigned a calibration
value, which corresponds to the heat flow density in
W/m2 when the plate provides an output of 1mV. The
calibration value will be stored as factory-setting in the
ALMEMO¢ç connector so that ALMEMO¢ç devices will
immediately indicate the current heat flow density in
W/m2.

Types:
Model   Application
117 FQA017C for even surfaces,
e.g. casement sections
118 FQA018C for universal applications,
e.g. solar-electric systems and insulating plates
119 FQA019C especially for constructional industry, brickwork insulating plates, old buildings
120 FQA020C small heat flow plate,
e.g. for medicine, veterinary medicine, small components etc.
117 SI FQA017CSI flexible heat flow plate, suitable for even surfaces,
e.g. casement sections
118 SI FQA018CSI flexible heat flow plate, suitable for even surfaces,
e.g. solar-electric systems and insulating plates
150-1 FQA0801H flexible heat flow plate, particularly suitable for high temperatures
e.g. for brickwork, insulated boilers and pipes
150-2 FQA0802H particularly suitable for high temperatures, especially for the construction industry,
masoned walls and insulating plates

Technical Data:
Type Dimensions
(mm)
Meander Size
(mm)
Substrate Temperature
Stability
Calibr. Val. approx.
(W/m2 ~ 1 mV)
Accuracy
of Calibr. Value
117 100 x 30 x 1.5 80 x 20 epoxy resin 80¡ÆC < 50 5% at 25¡ÆC
118 120 x 120 x 1.5 90 x 90 epoxy resin 80¡ÆC < 15 5% at 25¡ÆC
119 250 x 250 x 1.5 180 x 180 epoxy resin 80¡ÆC < 8 5% at 25¡ÆC
120 33 ¨ª x 1.5 20 20 ¨ª epoxy resin 80¡ÆC < 150 5% at 25¡ÆC
117SI 100 x 30 x 3 80 x 20 silicone 80¡ÆC < 50 5% at 25¡ÆC
118SI 120 x 120 x 3 90 x 90 silicone 80¡ÆC < 15 5% at 25¡ÆC
150-1 180 x 100 x 0.6 170 x 90 Teflon 150¡ÆC < 80 5% at 25¡ÆC
150-2 500 x 500 x 0.6 490 x 490 Teflon 150¡ÆC < 10 5% at 25¡ÆC

Accessories:
ZB9000WP Heat-conducting paste
ZQ9017KB Scotch tape for room temperature
ZQ9017KF Self-adhesive film 24 x 100cm for room temperature
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